Master Bond, Inc.

Thermally Conductive Adhesives Keep Things Cool

Stating that the current microprocessors dissipate up to 100 W, this paper briefs about the challenge faced by design engineers, and explains how thermal interface materials, which fill in the air gaps between thermal transfer surfaces, are one of the key cooling measures. It highlights how smart engineers have long taken a systems approach to thermal management, employing a wide variety of active and passive cooling measures to get the heat away from sensitive electronic components. Also explained are the advantages of thermal adhesives and thermal plotting compounds, and physical, mechanical, and electrical properties of thermally conductive products offered by Master Bond. Figure illustrating thermal interface materials and table presenting a variety of thermal adhesive grades and its features, are also included.