Master Bond, Inc.
Manufacturer
•Hackensack, NJ 07601-3950
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Master Bond, Inc.
Hackensack, NJ 07601-3950
Transaction Assurance Available
Protects your purchases for 21 days after the delivery date or intended delivery date. Learn MoreBusiness Description
- Adhesive Dispensing Equipment Details
- |
- About Master Bond, Inc.
Manufacturer of adhesives, coatings & sealants in a wide selection of packaging. Packaging options include special adhesive dispensers, sealant dispensers & dispensing gun applicators equipped with cartridges & mixers. Manually operated & pneumatic powered gun applicators are used for dispensing two component epoxy systems. Other types include flexible divider pouch, bubble packs, syringes & cartridges premixed & frozen epoxy systems, die/laser cut performs & ultraviolet specialty packaging.
Company Description by Thomasnet
Formulation of adhesives, sealants, coatings, potting, and encapsulation compounds. Specializing in the manufacturing of one and two part epoxies, silicones, UV and LED curing systems, and urethane modified and polysulfide modified epoxies. Properties include chemical resistance, thermal conductivity, high temperature resistance, biocompatibility, low outgassing, thermal and mechanical properties, and more. Products can be customized to meet specific application requirements. Serves the electronics, medical, optical, photonics, aerospace, OEM, automotive, and other high-tech industries. One-on-one assistance is provided. Product line includes compounds that comply with ASTM, USP Class VI, NASA, FAR, FDA & UL94 V-0, Mil-Std, and other certifications.
Company Description by Master Bond, Inc.
Master Bond is a leading adhesive manufacturer offering high quality adhesives, sealants, coatings, and potting compounds. Master Bond's product line consists of epoxy adhesives, polyurethane, silicone, cyanoacrylate and latex adhesives.
Master Bond's structural adhesives offer design flexibility and provide excellent bonding performance with a vast array of 3,000 custom designed adhesive formulations. Adhesive properties differ in viscosity, cure speed, temperature and chemical resistance, strength, electrical and thermal conductivity.
Specific adhesive systems can be designed to meet USP Class VI certification for medical use or NASA requirements for low outgassing. Master Bond products are successfully implemented in medical, optical, aerospace, electronic, and other hi-tech industries.
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Featured White Paper
This paper provides an understanding of the chemistry, properties, and applications of low-outgassing ASTM E595-compliant adhesives. The industry standard test for measuring outgassing in adhesives and other materials, ASTM E595, is explained, stating the cost implications of low-outgassing adhesives. A list of applications that typically require low-outgassing adhesives is included. Outgassing tendencies of adhesives are detailed, focusing on the importance of considering cure schedules when selecting adhesives for low-outgassing applications. The paper also lists the properties and applications of various popular low-outgassing adhesives offered by Master Bond Inc.
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Products / Services Offered
Business Details
Primary Company Type:
- Manufacturer
Additional Activities:
- Custom Manufacturer, Service Company, Finishing Service Company
Key Personnel:
- Jane Trager, Marketing Dept
Social:
Diverse / Small Bus. Status
Certifications / Registrations
Annual Sales:
- $5 - 9.9 Mil
No of Employees:
- 10-49
Year Founded:
- 1976
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Additional Information Provided by Master Bond, Inc.
Product Information
While bonding thermoplastic polyurethanes (TPUs) is known to be challenging, Master Bond has formulated UV17Med, a UV curable adhesive specially formulated for TPU to TPU bonding. This compound passes ISO 10993-5 for cytotoxicity making it ideal for use in various medical device applications. Watch this video to learn more.
Master Bond UV15 is a one component, high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It features exceptional thermal stability and very low shrinkage upon cure.
Two component, room temperature curable, high temperature resistant epoxy system, sealant, coating and casting system. EP42HT-2Med resists multiple cycles of medical sterilization including radiation, chemicals and steam. Meets USP Class VI requirements.
Master Bond Polymer System Supreme 10HTFL is a one component flexible high performance epoxy resin based adhesive/sealant with an exceptionally wide service temperature range of -300°F to +300°F. It cures readily to a tough, strong flexible thermoset polymer at temperatures of 250-300°F and above.
Master Bond Polymer System EP21TCHT-1 is a two component epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures.
EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA qualified for low outgassing applications. It is highly recommended for use in vacuum environments.
In this demonstration, Master Bond EP65HT-1 epoxy is used to show how a fast curing compound can set up quickly at room temperature. This two part system is commonly utilized for advanced engineering applications. It is a sure winner to speed up your assembly operations.
The beauty of thermally conductive adhesives and potting compounds is that they can manage heat while solving other application issues. Design engineers are often faced with the task of attaining reliable performance while protecting the circuitry of complex electronic devices. Learn how advanced adhesives and related compounds can help to meet these challenges.
Using a gun applicator for mixing and dispensing of two component epoxy systems.
Master Bond epoxies feature outstanding physical strength properties for high performance bonding, sealing, coating, potting and encapsulation. Our polymer compounds are formulated to meet challenging physical strength requirements.
Capabilities / Services
Max has shaped up our epoxies, now it's time to ship them out. Join Maximus Bond as he travels the world shipping Master Bond epoxies, silicones and more. Learn about Master Bond's prompt and reliable worldwide shipping options.
News & Press Releases
Products in the News
July 20, 2023 - Master Bond Supreme 3DM-85 is a no-mix, non-solvent-based, one-component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally...
Products in the News
May 2, 2023 - Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus. It has a thixotropic paste consistency making it ideal for bonding, sealing and gap filling applications. These properties are especially useful for opto-electronics or applications needing high dimensional stability and good heat resistance. EP5LTE-100 passes NASA low outgassing specifications. It...
Products in the News
April 19, 2023 - Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat. This dimensionally stable system features excellent mechanical properties with both a high modulus and die shear strength. It transfers heat and resists thermo-mechanical stresses effectively. EP17HTDA-2 has exceptional temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a...
Products in the News
March 16, 2023 - Master Bond LED415DC90 is a one component adhesive system that cures rapidly upon exposure to a 405 nm wavelength LED light source without any oxygen inhibition. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive. This no-mix system requires a post cure with heat and adheres well to both similar and dissimilar substrates. “Conventional light curing adhesives do not allow light penetration...
Products in the News
February 9, 2023 - Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. It features high temperature resistance and good strength properties. As an electrically insulative material, it can be utilized in medical electronic applications. This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®, Cidex® and Steris®, successfully resisting a...
Products in the News
January 6, 2023 - Master Bond Supreme 42HT-2ND Black is a two-part, non-drip epoxy system designed for bonding, sealing and coating applications. It is capable of withstanding temperatures up to 450°F (232°C), and provides a glass transition temperature (Tg) of 130-135°C. The material meets NASA low outgassing standards and is recommended for applications that require vacuum compatibility. Supreme 42HT-2ND Black is electrically insulative with a volume resistivity greater than 1014 ohm-cm. This...
Products in the News
November 15, 2022 - Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity. It requires a cure at only 80°C for 1.5 to 2 hours. To optimize performance properties a post-cure of 1-2 hours at 80°C is recommended. Featuring a thixotropic paste consistency, this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many...
Products in the News
October 14, 2022 - Master Bond MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace, electronic, optoelectronic and specialty OEM industries. This system has a thermal conductivity of 1.15-1.30 W/(m•K). It is highly...
Products in the News
September 8, 2022 - Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for non-cytotoxicity. This product cures at moderate temperatures of around 80-85°C within 60 to 90 minutes and faster at slightly higher temperatures. As a one part, non-premixed and frozen system, it contains no solvents and has an “unlimited” working life at room temperature. Suitable...
Products in the News
August 2, 2022 - Master Bond EP40ND is a two component epoxy system, designed for bonding, sealing and coating applications. It is a non-drip, toughened system with an easy to use 1:1 mix ratio by weight or volume. EP40ND meets NASA low outgassing specifications and has a high elongation of 80-90% at 75°F. It adheres well to many plastics, such as polycarbonates and acrylics, making it appropriate for applications that use substrates prone to stress cracking. This flexible system provides a low tensile...
White Papers & Case Studies
This paper provides an understanding of the chemistry, properties, and applications of low-outgassing ASTM E595-compliant adhesives. The industry standard test for measuring outgassing in adhesives and other materials, ASTM E595, is explained,... View More and Download
Check out this white paper to learn about the properties, characteristics, and applications of silicones. View More and Download
Check out this white paper to discover the benefits of using die attach epoxy adhesives for semiconductor manufacturing. View More and Download
Specialty formulations of epoxies protect medical electronic devices from stress, vibration, shielding and grounding. View More and Download
A guide to properly protecting Chip on Board (COB) using glob top encapsulants. View More and Download
Stating that the current microprocessors dissipate up to 100 W, this paper briefs about the challenge faced by design engineers, and explains how thermal interface materials, which fill in the air gaps between thermal transfer surfaces, are one of... View More and Download
